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Accelerates the Development of Embedded Devices Using the Intel Architecture and Zuken's Latest Tool

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Zuken Achieves Compatibility With the New Intel Circuit Diagram Review Service Format "ISCF"
Accelerates the Development of Embedded Devices Using the Intel Architecture and Zuken's Latest Tool
(Nov 1, 2012)
Zuken Inc. ("Zuken") has developed the module "ISCF export for Intel Schematic review" that achieves compatibility with the new Intel circuit design review service format "ISCF."

"ISCF," with the aim of shortening the time taken for the review of circuits loaded on products for Intel embedded devices, has improved the legacy EDIF-based format, and made large-scale reductions in the volume of data, by newly adding E-net information (electrical connection information) and bus information while reviewing data redundancy.

Both the Design Gateway version and System Designer version of this module can be downloaded from the Zuken support website from the middle of November, and Zuken users can use them free of charge.

Using these modules, Zuken users developing circuits loaded on products for Intel embedded devices can obtain review results more rapidly and accurately than before.

In advance of this announcement, a related technical lecture was given by Erik E Erlandson of Intel Corporation at the "Zuken Innovation World Americas" (held: October 16th (Tue)-17th (Wed), location: California, USA).


(*) Intel, the Intel logo, Intel Core and Intel Atom are trademarks of Intel Corporation in the United States and other countries. Other company names, product names, etc. are generally trademarks or registered trademarks of their respective companies.

For inquiries on this matter, please contact
Zuken Inc. Corporate Communications
Tel: +81-45-942-1511
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