Export

Export to SOC tools
  • I/O cell placement data
  • Die pad placement data
  • RDL data
  • Net data
Export to package tools
  • Bump and ball pin assignments
  • Wire bonding lines and wire bonding pads
  • Package routing
  • Layer data
Export to analytic tools
  • Sigrity's Speed2000
  • Optimal's PakSi-E