Automatic Routing

RDL routing
  • Routing from I/O cell pads to FC bumps
  • Compact routing allowing for SSN/45 degree routing/wire width specification for each routing
    Tree routing/routing from multiple pads to a single bump
Escape routing
  • Routing to chip exteriors while avoiding FC bumps
  • Routing for multiple layers
Generation of rings and wire bonding pads
  • Formation of power supply and ground rings, and wire bonding pads
  • Works with no rings
Generation of wire bonding lines
  • Generation of wire bonding lines, vertical and circular
Package pin assignment
  • Automatic net assignments to package balls
  • Import of CSV specifying power supply and ground pin
Package routing
  • Package routing density display
  • Can be used with plating bars